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| (R) TN1215-600B STANDARD SCR FEATURES ITRMS = 12 A VDRM / VRRM = 600 V IGT < 15 mA ITSM = 110 A DESCRIPTION The TN1215-600B SCR uses a high performance TOPGLASS PNPN technology. This part is intended for general purpose applications using surface mount technology and requiring high surge capability (power tools, crowbar protection, voltage regulation, etc...). ABSOLUTE MAXIMUM RATINGS Symbol VDRM VRRM IT(RMS) IT(AV) ITSM Parameter Repetitive peak off-state voltage RMS on-state current (180 conduction angle) Average on-state current (180 conduction angle) Non repetitive surge peak on-state current (Tj initial = 25C) I2t Value for fusing Critical rate of rise of on-state current dIG /dt = 1 A/s. IG = 20 mA Storage junction temperature range Operating junction temperature range Maximum temperature for soldering during 10s Tj = 125C Tc= 105C Tc= 105C tp = 8.3 ms tp = 10 ms I2t dI/dt Tstg Tj T tp = 10ms Value 600 12 8 115 110 60 50 - 40 to + 150 - 40 to + 125 260 A2s A/s C C Unit V A A A K A A G DPAK september 1998 - Ed: 1A 1/5 TN1215-600B THERMAL RESISTANCES Symbol Rth(j-a) Rth(j-c) Parameter Junction to ambient (S=0.5cm2) Junction to case for D.C Value 70 1.5 Unit C/W C/W GATE CHARACTERISTICS PG (AV)= 1W PGM = 10 W (tp = 20 s) IGM = 4 A (tp = 20 s) VRGM = 5 V ELECTRICAL CHARACTERISTICS Symbol IGT Test Conditions VD = 12V (DC) RL= 33 Tj= 25C Type MIN MAX VGT VGD IH VTM IDRM IRRM dV/dt VD = 12V (DC) RL= 33 VD = VDRM RL = 3.3k IT= 100mA Gate open Tj= 25C Tj= 125C Tj= 25C Tj= 25C Tj= 25C Tj = 125C Tj= 125C MAX MIN MAX MAX MAX MAX MIN Value 2 15 1.5 0.2 40 1.6 10 2 200 V V mA V A mA V/s Unit mA ITM= 24A tp= 380s VD = VDRM VR = VRRM Linear slope up to VD=67%VDRM Gate open ORDERING INFORMATION TN STANDARD SCR 12 15 - 600 SENSITIVITY B (-TR) Tape & Reel PACKAGES : B: DPAK CURRENT 2/5 VDRM / VRRM TN1215-600B Fig. 1: Maximum average power dissipation versus average on-state current . Fig. 2 : Correlation between maximum average power dissipation and maximum allowable temperatures (T amb and T case) for different thermal resistances. P(W) P(W) 14 12 14 12 10 8 6 360 Rth=0C/W Tcase (C) 105 110 115 Rth=70C/W Rth=37C/W 10 8 6 4 2 0 0 2 4 2 120 125 IT(av)(A) 4 6 8 0 0 20 40 10 12 60 80 Tamb(C) 100 120 140 Fig. 3: Average and D.C. on-state current versus case temperature. Fig. 4: Average and D.C. on-state current versus ambient temperature (Printed circuit board FR4, SCu=0.5cm2). IT(av)(A) 2.50 2.25 2.00 1.75 1.50 1.25 1.00 0.75 0.50 0.25 0.00 IT(av)(A) 14 12 10 8 6 4 2 0 0 25 Tcase(C) 50 75 100 125 D.C. D.C. Tamb(C) 0 25 50 75 100 125 Fig. 5: Relative variation of thermal impedance junction to ambient versus pulse duration (recommended pad layout). K=[Zth(j-a)/Rth(j-a)] 1.00 Fig. 6: Relative variation of gate trigger current and holding current versus junction temperature Igt,IH[Tj]/Ig,IH[Tj=25C] 2.5 2.0 Igt 1.5 0.10 1.0 0.5 tp(s) 0.01 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 IH Tj(C) 0.0 -40 -20 0 20 40 60 80 100 120 140 3/5 TN1215-600B Fig 7: Non repetitive surge peak on-state current versus number of cycles. Fig 8: Non repetitive surge peak on-state current for a sinusoidal pulse with width tp<10ms, and corresponding value of I2t. ITSM(A),It(As) 500 Tj initial=25C F=50Hz 120 100 80 ITSM(A) Tj initial=25C ITSM 100 60 40 20 Number of cycles 0 1 10 100 1000 It tp(ms) 10 1 2 5 10 Fig 9: On-state characteristics (maximum values). Fig 10: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35m). Rth(j-a) (C/W) 100 100.0 ITM(A) Tj max.: Vto=0.85V Rt=30m Tj=Tj max. 80 60 10.0 Tj=25C 1.0 40 20 VTM(V) 0.1 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0 0 2 4 6 S(Cu) (cm) 8 10 12 14 16 18 20 4/5 TN1215-600B PACKAGE MECHANICAL DATA DPAK DIMENSIONS REF. A A1 A2 B B2 C C2 D E G H L2 L4 V2 0.60 0 Millimeters Min. Typ. 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35 0.80 1.00 0.023 8 0 Max 2.40 0.086 1.10 0.035 0.23 0.001 0.90 0.025 5.40 0.204 0.60 0.017 0.60 0.018 6.20 0.236 6.60 0.251 4.60 0.173 10.10 0.368 0.031 0.039 8 Inches Min. Typ. Max. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397 FOOT PRINT DIMENSIONS (in millimeters) 6.7 WEIGHT : 0.30g MARKING TYPE MARKING TN 1215 6 6.7 TN1215-600B 6.7 3 1.6 2.3 2.3 1.6 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 1998 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. http://www.st.com 5/5 |
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